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NIPPON FILCON have over 30years career in ultra precision
process for metal etching..
Photo-etching process have the advantage of free design, accuracy
of manufacture and
economical initial cost over the other metal process.
NIPPON FILCON has an accumulation for technology that is based
on long time research and development. and we have gotten great
confidence from customer including the@electronic industry.
NIPPON FILCON also assembles and processes various metal parts
by plating, welding, and gluing using it proprietary metal processing
technologies over the years.
 And
our process can manufactures variety materials and substrate
size and thickness.This way NIPPON FILCON technology has many
advantages in photo-etch industries.
We advise let's try to use our advanced photo-etched products.
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| mass
product substrate size |
max 1050mm~1750mm |
| mass
product substrate thickness |
0.018mm`3mm |
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| substrate materia |
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| stainless-steel |
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| Ssus304,sus301,sus316,sus430,sus631,etc. |
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| copper-alloy |
c1020,c1100,phospher
bronze,brass,copper-alloyforleadflames |
| nickel-alloy |
alloy42,kovar,parmalloy,invar,nichrome,inconel,etc. |
| others |
molybdenum,
aluminum-alloy, |
| post-etched
process |
pressing |
press bending,
make holes,cutting, squeezing, etc. |
| shaving |
drilling,wire-thunderstroke
cutting, laser-cutting, etc. |
| grinding |
barrel-grinding,puff-polishing,electrolysis-polishing |
| gluing |
adhesive
gluing, spot-welding,vacuum heat-bonding |
| surface
treatment |
hairline,
mat-surface, rustproof-finish,oxidized black, plating(gold,
silver,copper, chrome, nickel, tin, solder) |
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