About photo-etched products
About photo-masks
NIPPON FILCON
micro
PHOTO-MASK PROCESS
FLOW CHART OF PHTO-MASK PROCESS
DETAIL INSTRUCTION OF PHOTO-MASK PROCESS
Ÿ Data conversion (CAD process)
@ When we received drawing data, you may send the whole data in GDS-II(stream) format and if you sent the partial data (main, alignment, monitor, etc.) we'll make the layout design. Of course we can make a layout design from a drawing on paper. And we can write directly not on EB date but on GDS-IIformat, that save the cost and time for data translation.
Equipment
‘ SX9000
‘ LAKES (Our original CAD system)
Data format
‘ GDS-II(Stream format)
‘ DXF
‘ EB data
MEDIA
‘ floppy disk
‘ E|mail
‘ Nifty
‘ FTP
‘ 1/4inch CMT
‘ MOi230MBA640MBj
‘ 8mmMT
‘ Drawing on paper
Ÿ Pattern generation process
@ After translate customer's design to the data for pattern generation we engrave the pattern on chrome blanks. And after this process, developing process, etching process, resist removing process and washing process, then the first step for photo-mask will be ended.
Ÿ EQUIPMENT
Ÿ Laser reticule writer LRS200
@ Use laser-beam, can write on the chrome blanks directly. Blanks size is 4"`9". This equipment can write a pattern with gradation treatment on software that is a merit of laser-beam engraver. On the EB equipment curved line will be "step shape" but use laser equipment that will be round shape. And other advantage of this equipment is the fine setting for pitch inclement (0.025micro-meter) and the uniformity on writing.
Ÿ Laser reticule writer OMEGA6060
@ this is the upper grade equipment of LRS200. this equipment has 1.5 times throughput and 2times performance.
Ÿ Pattern generator LZ340
@ This equipment has variable apartcher and write a pattern in square dot form. Maximum blanks size is 18"~20"plate, and it can write step and repeat in using reticule mask.
INSPECTION PROCESS
Ÿ Basic inspection
@ This is the basic inspection for photo-masks substrate material, name of mask pattern, layout, top or bottom of substrate surface, scratch, etc.
Ÿ Microscopic measure inspection
@ Equipment:Nikon@MPA|3
Optical microscope with micro slit. Scanning enlarged picture edge by micro slit and measuring automatically with the transition of transparency.
Ÿ Absolute measure inspection
@ Equipment:lightwave interference coordinates measuring instrument Nikon@XY-5I
Measure coordinate pattern position, pitch, and micro line width automatically by irradiating laser-beam spot on a mask
Ÿ Defect inspection
@ Equipment: Automatic defect inspection machine Lasertech 9MD-82SR /KLA239HR, etc.
This machine inspects the defect by comparing next pattern.
Contact print process
Ÿ Equipment: TAMARAC M-155
@ Exposing on chrome blanks with hard contacting to the master mask. @
HOME English Chinese
HOME | English | Chinese
Copyright 2001 (C) NIPPON FILCON CO., LTD.
About photo-etched products About precision photographic products About photo-masks micro contact us An outline of photo-etching process Practical example of photo-etched products(half-etching) A standard of photo-mask inspection   An outline of photo-mask process BACK